• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    An object of the present invention is to provide a low cost piezoelectric component which is simple in production and excellent in electrical characteristics. A piezoelectric component according to the present invention includes a piezoelectric element, a damping member, a supporting substrate for mounting the piezoelectric element, and a cover member. On the upper surface of the piezoelectric element, a damping member having a predetermined hardness is provided to cover the vibration electrode. In the case of a piezoelectric trap, a damping member having a Shore hardness of 35 to 80 is used, and in the case of a piezoelectric discriminating circuit, a damping member having a Shore hardness of 80 to 100 is used.
    公开号:KR20010020839A
    申请号:KR1020000025613
    申请日:2000-05-13
    公开日:2001-03-15
    发明作者:사와이구니오；하시모토히사유키
    申请人:무라타 야스타카；가부시키가이샤 무라타 세이사쿠쇼；
    IPC主号:
    专利说明:

    Piezoelectric Component
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to piezoelectric components and, more particularly, to piezoelectric components such as traps for removing signals having a specific frequency or discriminators for discriminating signals.
    In general, piezoelectric parts such as traps and discrimination circuits using thickness shear vibrations or thickness longitudinal vibrations include rectangular piezoelectric substrates having vibrating electrodes formed on both main surfaces, and case members such as alumina for accommodating the piezoelectric substrates. The accommodating portion made of a material and a lid member for shielding the accommodating portion with the piezoelectric substrate therein are constituted, and the piezoelectric substrate is supported in the case so as to vibrate the vibrating portion. In the piezoelectric component having such a configuration, since the thickness shear vibration and the like are vibration modes in which the thickness center of the piezoelectric substrate is the node point (node), damping is made of silicon rubber on both main surfaces of the piezoelectric substrate on which the vibration electrodes are formed, respectively. By imparting members, electrical properties such as damping, group delay characteristics, and distortion rates were adjusted to the desired values.
    By the way, in the conventional piezoelectric components, since damping members are provided to both main surfaces of the piezoelectric substrate, the damping members must be provided twice to the piezoelectric substrate. Therefore, there is a problem that the number of manufacturing steps of the piezoelectric parts increases, and the manufacturing cost of the piezoelectric parts increases.
    It is an object of the present invention to provide a low cost piezoelectric component which is simple to manufacture and further excellent in electrical characteristics.
    1 is an exploded perspective view of a piezoelectric component according to a first embodiment of the present invention.
    FIG. 2 is a perspective view of a piezoelectric element used in the piezoelectric component shown in FIG. 1.
    3 is a longitudinal cross-sectional view of the piezoelectric component shown in FIG. 1.
    4 is a graph showing a change in the trap attenuation amount of the piezoelectric component shown in FIG. 1 with respect to the hardness of the damping member.
    FIG. 5 is a graph showing the relationship between the group delay time of the piezoelectric component shown in FIG. 1 and the hardness of the damping member.
    6 is an exploded perspective view of a piezoelectric component according to a second embodiment of the present invention.
    7 is a longitudinal sectional view of a piezoelectric component according to a second embodiment of the present invention.
    FIG. 8 is a graph showing a relationship between the distortion rate of the piezoelectric component shown in FIG. 6 and the hardness of the damping member.
    9 is an exploded perspective view of a piezoelectric component according to a third embodiment of the present invention.
    FIG. 10 is a perspective view illustrating an appearance of the piezoelectric substrate illustrated in FIG. 9.
    * Description of the symbols for the main parts of the drawings *
    10 piezoelectric trap 11 piezoelectric element
    12 damping member 15 piezoelectric substrate
    21a, 21b, 22a, 22b: vibration electrode 50: piezoelectric discrimination circuit
    51 piezoelectric element 52 damping member
    55: piezoelectric substrate 61, 62: vibration electrode
    70: piezoelectric trap 72, 73: damping member
    80: piezoelectric substrate 81a, 81b, 82a, 82b: vibration electrode
    In order to achieve the above object, the piezoelectric component according to the present invention includes a piezoelectric substrate having a vibrating electrode formed on both main surfaces thereof and vibrating in a thickness shear mode; And a damping member disposed on one main surface of both main surfaces of the piezoelectric substrate so as to cover the vibration electrode and having a predetermined hardness.
    According to the above structure, the damping member which has a suitable hardness can be arrange | positioned on only one main surface of a piezoelectric substrate, and a required electrical characteristic can be acquired. More specifically, in the case of using a damping member having a Shore hardness of 35 to 80, the damping member is disposed on only one main surface of the piezoelectric substrate so that the damping characteristic and the group delay characteristic satisfying the required specification as a trap. Can be obtained.
    In addition, when the Shore hardness of 80-100 is used as a damping member, a damping member can be arrange | positioned on only one main surface of a piezoelectric substrate, and the distortion factor characteristic which satisfy | fills the specification required as a discrimination circuit can be obtained.
    Hereinafter, a piezoelectric component according to an embodiment of the present invention will be described with reference to the accompanying drawings.
    1st Embodiment, FIGS. 1-5
    1 illustrates the application of a piezoelectric component to a trap according to an embodiment of the present invention. The piezoelectric trap 10 includes a cover for covering the piezoelectric element 11 on the piezoelectric element 11, the damping member 12, the support substrate 13 for transferring the piezoelectric element 11, and the support substrate 13. The member 14 is comprised.
    As shown in FIG. 2, the piezoelectric element 11 is formed on a rectangular piezoelectric substrate 15 such as PZT, two vibration electrodes 21a and 22a formed on the upper surface of the piezoelectric substrate 15, and a bottom thereof. It consists of two vibration electrodes 21b and 22b. The vibration electrodes 21b and 22b oppose the vibration electrodes 21a and 22a, respectively, with the piezoelectric substrate 15 sandwiched therebetween. At the left end of the piezoelectric substrate 15, a terminal electrode 31 is formed extending from the upper surface to the lower surface. The terminal electrode 31 is connected to the vibrating electrode 21a. At the right end of the piezoelectric substrate 15, a terminal electrode 32 extending from the top surface to the bottom surface is formed. The terminal electrode 32 is connected to the vibration electrode 22a. The terminal electrode 33 is formed between the vibrating electrodes 21b and 22b formed in the bottom surface of the piezoelectric substrate 15, The terminal electrode 33 is connected to the vibrating electrodes 21b and 22b.
    The supporting substrate 13 is made of an insulating material such as alumina, and the upper surface thereof is connected to the connection electrodes 41 to 43 formed on the upper surface thereof, respectively corresponding to the terminal electrodes 31 to 33 of the piezoelectric element 11. It is. Both ends 41a of the connection electrode 41 extend in the notches 13a formed on two sides of the support substrate 13, respectively. Both ends 42a of the connection electrode 42 extend in the notches 13b formed on two sides of the support substrate 13, respectively. Both ends 43a of the connection electrode 43 extend in the notches 13c formed on two sides of the support substrate 13, respectively.
    The conductive adhesives 16 (refer FIG. 3) are respectively apply | coated to the connection electrodes 41-43 of the support substrate 13 by printing etc., and these terminal adhesives 31 of the piezoelectric element 11 are applied by these conductive adhesives 16, respectively. To 33) are bonded to each other. Thereby, the vibration part of the piezoelectric element 11 is conveyed to the support substrate 13 in the state in which the vibration part has a gap in the support substrate 13 formed by the thickness of a conductive adhesive agent.
    On the upper surface of the piezoelectric substrate 15, a damping member 12 made of silicone rubber having a Shore hardness of 35 to 80 is applied by a method similar to the printing method, and covers the vibrating electrodes 21a and 22a.
    The glass paste film 17 is formed in the peripheral part of the upper surface of the support substrate 13 by printing. The cover member 14 made of a metal material is bonded to the glass paste film 17 so as to cover the piezoelectric element 11. The cover member 14 is electrically connected to a connection electrode 43 for grounding with a conductive adhesive or the like through the hole 18 formed in the glass paste film 17. As a result, the piezoelectric element 11 is shielded electronically.
    In the piezoelectric trap 10 of the above structure, the damping member 12 slows the thickness shear vibration which arises in the piezoelectric element 11 from the upper surface side in which the vibrating electrodes 21a and 22a were formed. Then, as the damping member 12 uses a material having a shore hardness of 35 to 80, as can be seen in Figs. The piezoelectric trap 10 having a group delay time of less than can be obtained.
    Second Embodiment, FIGS. 6-8
    6 illustrates the application of a piezoelectric component to a discriminating circuit according to an embodiment of the present invention. The piezoelectric discriminating circuit 50 includes a piezoelectric element 51, a damping member 52, a case 53 for accommodating the piezoelectric element 51, and a lid member 54 for shielding the upper opening of the case 53. )
    The piezoelectric element 51 consists of a rectangular piezoelectric substrate 55 in which a vibrating electrode 61 is formed on an upper surface and a vibrating electrode 62 is formed on a bottom surface. The vibrating electrodes 61 and 62 are formed to face each other at the center of the piezoelectric substrate 55. The lead portion 61a of the vibrating electrode 61 extends from the upper surface to the lower surface at the left end of the piezoelectric substrate 55. The lead portion 62a of the vibrating electrode 62 extends from the bottom to the top surface at the right end of the piezoelectric substrate 55.
    The case 53 is made of an insulating material such as alumina, and has a recess 56 for accommodating the piezoelectric element 51. At both ends of the recess 56, stepped portions 57 and 58 are formed at both ends of the piezoelectric element 51, respectively. According to the stepped portions 57 and 58, as shown in FIG. 7, the piezoelectric element 51 is supported with its vibration portion having a gap between the bottom surface 59 of the recess 56.
    In the case 53, connection electrodes 62 and 63 extending from the step portions 57 and 58 to the outer circumferential surface are formed. The conductive adhesive 64 is provided to the stepped portions 57 and 58, and the lead portions 61a and 62a of the vibrating electrodes 61 and 62 of the piezoelectric element 51 are connected to the connecting electrode 62 by the conductive adhesive 64. And 63), respectively.
    On the upper surface of the piezoelectric substrate 55, a damping member 52 made of silicone rubber having a Shore hardness of 80 to 100 is provided, and covers the vibration electrode except for the lead portion 61a.
    The lid member 54 is bonded to the circumferential portion of the upper surface opening of the case 53. Connection electrodes 65 and 66 electrically connected to the connection electrodes 62 and 63 of the case 53 are also formed at both ends of the lid member 54.
    In the piezoelectric discriminating circuit 50 of the above structure, the damping member 52 slows down the thickness shear vibration which arises in the piezoelectric element 51 from the upper surface side in which the vibration electrode 61 was formed. As the damping member 52 By using a material having a Shore hardness of 80 to 100, as shown in FIG. 8, the piezoelectric discrimination circuit 50 having a distortion ratio of less than 1 percent (= upper limit of the specification) can be obtained.
    [Third Embodiment, FIGS. 9 and 10]
    The third embodiment is described in connection with a monolithic piezoelectric trap. As shown in FIG. 9, the piezoelectric trap 70 is comprised from the piezoelectric element 71 and the protective substrates 74 and 75 which form the vibration space through this piezoelectric element 71.
    The piezoelectric element 71 is made of a piezoelectric substrate 80, and vibration electrodes 81a and 82a are formed on the upper surface of the piezoelectric substrate 80. On the bottom of the piezoelectric substrate 80, vibration electrodes 81b and 82b are formed so as to face the vibration electrodes 81a and 82a, respectively. An extraction electrode 84 is formed at the left end of the piezoelectric substrate 80, and the extraction electrode 84 is connected to the vibration electrode 81a. An extraction electrode 85 is formed at the right end of the piezoelectric substrate 80, and the extraction electrode 85 is connected to the vibration electrode 82a. A lead-out electrode 86 is formed between the vibrating electrode 81b and the vibrating electrode 82b of the bottom surface of the piezoelectric substrate 80, and this lead-out electrode 86 is connected to the vibrating electrodes 81b and 82b.
    On the upper surface of the piezoelectric substrate 80, damping members 72 and 73 made of silicon rubber having a Shore hardness of 35 to 80 are provided by methods such as a printing method so as to cover the vibrating electrodes 81a and 82a, respectively. It is becoming. In the central portion of the protective substrates 74 and 75, recesses 74a and 75a for forming the vibration space are formed, respectively. The protective substrates 74 and 75 are made of ceramic material or resin material. The vibration space forming recesses 74a and 75a are not necessarily required, and the vibration space may be protected by the thickness of the adhesive used for bonding the protective substrates 74 and 75 to the piezoelectric elements 71.
    The protective substrates 74 and 75 are coupled to the piezoelectric element 71 via an adhesive. In this way, as shown in FIG. 10, the laminated body 90 which has the vibration space sealed inside is obtained. External electrodes 91 and 92 are formed at both ends of the laminate 90, and external electrodes 93 are formed at the center thereof. The external electrodes 91, 92, 93 are electrically connected to the extraction electrodes 84, 85, 86, respectively.
    The piezoelectric trap 70 of the above structure has the same effect | action and effect as the piezoelectric trap 10 which concerns on 1st Embodiment mentioned above.
    [Other Embodiments]
    This invention is not limited to the said embodiment, It can change into various kinds within the range of the summary of this invention. For example, the piezoelectric element 11 of the trap according to the first embodiment may be accommodated in the case 53 of the second embodiment, or the piezoelectric element 51 of the second embodiment is supported. The substrate 13 may be positioned opposite to the substrate 13. Moreover, the damping member may be provided on the bottom face instead of the top face of the piezoelectric substrate.
    As can be seen from the above description, according to the present invention, since a damping member having a predetermined hardness is provided on one main surface side of the piezoelectric substrate, the shearing vibration of the piezoelectric element is slowed to obtain necessary electrical characteristics. The number of processes for imparting a reduction can be reduced, manufacturing is easy, and cheap piezoelectric parts can be obtained.
    For example, when using a Shore hardness of 35 to 80 as the damping member, the damping member is disposed on only one main surface of the piezoelectric substrate to obtain damping characteristics and group delay characteristics satisfying the specifications required as traps. Can be easily manufactured.
    In addition, when using a Shore hardness of 80 to 100 as the damping member, by placing the damping member on only one main surface of the piezoelectric substrate, it is possible to obtain a distortion ratio characteristic that satisfies the required specification as a trap, and facilitates the discrimination circuit. Can produce.
    权利要求:
    Claims (3)
    [1" claim-type="Currently amended] A piezoelectric element including a piezoelectric substrate having vibrating electrodes formed on both main surfaces thereof and vibrating in a thickness shear mode; And
    A damping member disposed on one of the main surfaces of the piezoelectric substrate so as to cover the vibration electrode, the damping member having a predetermined hardness; Piezoelectric component comprising a.
    [2" claim-type="Currently amended] The piezoelectric component of claim 1, wherein the damping member has a Shore hardness of 35 to 80. 3.
    [3" claim-type="Currently amended] The piezoelectric component according to claim 1, wherein the damping member has a shore hardness of 80 to 100.
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    同族专利:
    公开号 | 公开日
    JP2000323959A|2000-11-24|
    DE10022271A1|2000-11-30|
    CN1274197A|2000-11-22|
    SG80679A1|2001-05-22|
    KR100371572B1|2003-02-06|
    US6369489B1|2002-04-09|
    CN1151600C|2004-05-26|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1999-05-14|Priority to JP11-134018
    1999-05-14|Priority to JP11134018A
    2000-05-13|Application filed by 무라타 야스타카, 가부시키가이샤 무라타 세이사쿠쇼
    2001-03-15|Publication of KR20010020839A
    2003-02-06|Application granted
    2003-02-06|Publication of KR100371572B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP11-134018|1999-05-14|
    JP11134018A|JP2000323959A|1999-05-14|1999-05-14|Piezoelectric parts|
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